JPH0711393Y2 - 基板型温度ヒューズ - Google Patents
基板型温度ヒューズInfo
- Publication number
- JPH0711393Y2 JPH0711393Y2 JP3169687U JP3169687U JPH0711393Y2 JP H0711393 Y2 JPH0711393 Y2 JP H0711393Y2 JP 3169687 U JP3169687 U JP 3169687U JP 3169687 U JP3169687 U JP 3169687U JP H0711393 Y2 JPH0711393 Y2 JP H0711393Y2
- Authority
- JP
- Japan
- Prior art keywords
- thermal fuse
- insulating substrate
- lead wire
- type thermal
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 38
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 11
- 238000002844 melting Methods 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000010410 layer Substances 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fuses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3169687U JPH0711393Y2 (ja) | 1987-03-04 | 1987-03-04 | 基板型温度ヒューズ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3169687U JPH0711393Y2 (ja) | 1987-03-04 | 1987-03-04 | 基板型温度ヒューズ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63139739U JPS63139739U (en]) | 1988-09-14 |
JPH0711393Y2 true JPH0711393Y2 (ja) | 1995-03-15 |
Family
ID=30837669
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3169687U Expired - Lifetime JPH0711393Y2 (ja) | 1987-03-04 | 1987-03-04 | 基板型温度ヒューズ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0711393Y2 (en]) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2574700B2 (ja) * | 1989-04-28 | 1997-01-22 | 内橋エステック 株式会社 | 平型温度ヒューズ |
JPH0740836Y2 (ja) * | 1990-05-16 | 1995-09-20 | パロマ工業株式会社 | 燃焼機器の過熱防止装置 |
JP4663758B2 (ja) * | 2007-08-20 | 2011-04-06 | 内橋エステック株式会社 | 抵抗付き温度ヒューズ及び電池保護回路板 |
-
1987
- 1987-03-04 JP JP3169687U patent/JPH0711393Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS63139739U (en]) | 1988-09-14 |
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